Microstructural characteristics of electrodeposited damascene copper lines
نویسندگان
چکیده
منابع مشابه
Copper voids improvement for the copper dual damascene interconnection process
The mechanism of copper (Cu) voids formation from electro-chemical plating (ECP) followed by Cu chemical mechanical polishing (CMP) are studied in Cu dual-damascene interconnection. The formation of Cu voids at metal lines is the main problem that causes not only the failure of via-induced metal-island corrosion but also yield loss. The galvanic theory and Cu lifting mechanism are proposed to e...
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ژورنال
عنوان ژورنال: Letters on Materials
سال: 2014
ISSN: 2218-5046,2410-3535
DOI: 10.22226/2410-3535-2014-2-104-107